GENERAL:
Series 60 Reed Relays meet the exacting requirements for low level, low thermal EMF, input devices for data acquisition systems.

Series 60 Reed Relays do not contribute any substantial self-generated EMF to the circuit to which they are connected. Careful selection of preconditioned, dynamically tested reuthenium contact switches form the heart of the Series 60. Series 60 relay contacts do not stick or miss when operated within TTL or thermocouple voltage ranges. Proprietary construction techniques and epoxy formulation assure a uniform thermal EMF offset relay to relay with a high IR of 10 to the 12th ohms (standard). Higher IR available upon request.

SPECIAL:
Copper pins exiting from the Series 60 relays from all switch connections assure a minimum thermal EMF junction at the printed circuit board connection. The copper pins are connected to the reed switches via a weld process. Solder is not used, except for the coil leads. Degradation of insulation resistance under conditions of high humidity and temperature due to "ion travel" cannot occur with the Series 60 relays.

OFFSET:
Maximum thermal offset for Series 60 relays is 1 microvolt.

Rigorous pretesting of the reed switch under actual low-level operating conditions is just the first step in EAC's efforts to build the most reliable Reed Relays in the industry. Our coils, for example, must pass no less than three inspections prior to reaching final assembly. In addition, each major construction operation is monitored by experienced inspectors who take pride in helping produce the most reliable relays possible.

Our engineering department is replete with the latest design and testing equipment to include two environmental chambers to duplicate the exact temperature and humidity conditions normally encountered by the Series 60.