TRUE SMT PROCESS COMPATIBILITY
ULTRA MINIATURE SIZE
SENSITIVE
COIL
COAXIAL E.S. SHIELD FOR RF
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| CONTACT RATINGS (RESISTIVE LOADS) |
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| PARAMETERS |
SERIES |
| SMS, SME & SMB |
SMC |
SMP |
| Power (W) Max. |
10 |
3 |
50 |
| Voltage (VDC) Max. |
150 |
100 |
200 |
| Switching Current (A) Max. |
0.5 |
0.25 |
1.0 |
| Carry Current (A) Max. |
1.0 |
0.5 |
2.0 |
| Contact Resistance (OHMS) Max. (Initial) |
0.2 |
0.2 |
0.2 |
| Breakdown Voltage |
Open Contact |
200 |
200 |
250 |
| (VDC) Min. |
Contact To Coil |
500 |
500 |
1500 |
| Insulation Resistance |
Open Contact |
10 to the 10th |
10 to the 9th |
10 to the 10th |
| (OHMS) Min. |
Contact To Coil |
10 to the 10th |
10 to the 9th |
10 to the 10th |
| Operate Time (MS) Max. Including Bounce |
0.1 |
0.2 |
0.5 |
| Release Time (MS) Max. |
0.5 |
0.25 |
0.5 |
| Electrical Life |
Low Level |
3 X 108 (10mVDC, 10µA) |
108 (10mVDC, 10µA) |
1 X 107 (10mVDC, 10µA) |
|
Rated Load |
8 X 105 (20VDC, 0.5A) |
2 X 106 (12VDC, 0.25A) |
1 X 106 (100VDC, 0.5A) |
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| DIMENSIONS UNIT: MM (INCH) |
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SMSJ SMBJ
 |
SMSG SMBG
 |
SMPJ
 |
SMEJ
 |
SMEG
 |
SMPG
 |
SMCJ
 |
SMCG
 |
| *Lead 0.5 x 0.25 (.020 x 0.010) |
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| COIL RATINGS |
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| Part # |
Nominal Voltage VDC |
Coil Resistance OHMS ±10% |
Operate Voltage VDC Max. |
Release Voltage VDC Min. |
Schematics |
SMPJ1A05
SMPG1A05 |
5 |
500 |
3.8 |
0.5 |
 |
SMPJ1A12
SMPG1A12 |
12 |
1000 |
9.0 |
1.0 |
SMPJ1A24
SMPG1A24 |
24 |
2000 |
18.0 |
2.0 |
SMSJ1A05
SMSG1A05 |
5 |
500 |
3.8 |
0.5 |
 |
SMSJ1A12
SMSG1A12 |
12 |
1000 |
9.0 |
1.0 |
SMEJ1A05
SMEG1A05 |
5 |
150 |
3.8 |
0.5 |
 |
SMEJ1A12
SMEG1A12 |
12 |
600 |
9.0 |
1.0 |
SMBJ1B05
SMBG1B05 |
5 |
500 |
3.8 |
0.5 |
 |
SMBJ1B12
SMBG1B12 |
12 |
500 |
9.0 |
1.0 |
SMCJ1C05
SMCG1C05 |
5 |
200 |
3.8 |
0.5 |
 |
SMCJ1C12A
SMCG1C12 |
12 |
500 |
9.0 |
1.0 |
| SCHEMATICS (TOP VIEWS) |
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| ORDERING INFORMATION |
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| SPECIAL NOTES |
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SURFACE MOUNT REED RELAY SOLDERING
Surface
mountable components are manufactured out of heat sensitive materials such
as glass, copper and/or dumet wire, silicon, germanium and a variety of
plastics, just to name a few. Each of these materials are relatively
stable in that physical deformation over time is minimal. However, these
physical and many electrical characteristics can and will change if
pre-heat, used in the reflow process is not defined and carefully
followed.
EAC has found that pre-heated
temperatures in use at a number of companies vary from no pre-heat to as
high as 330° C. for several minutes. No standard appears to exist and
the component manufacturer suffers due to this lack of standardization.
One
common dominator has risen however. It is field failure rate. Our survey
has shown that our SMT reed relay customers who use a pre-heat of
100° C. or less, exhibit little or no solder related component
failures at the final test area or in early field failures.
We
therefore suggest that a pre-heated temperature not to exceed 100° C.
is ideal, along with a reflow time of 20 to 80 seconds. |
16475
Canyon Hills Road #3